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Shenzhen Xinxing Electric Technology Co., Ltd.
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Cell Phone HDI PCB

Cell Phone HDI PCB

Supply Ability : 500000 Square Meter/Square Meters per Month
Port : Shenzhen
Packaging Details : 1. at buyer's request; 2. innerVacuum packing; 3. outer, standard export carton
MOQ : 1 Piece/Pieces
Delivery Time : PCB: 3-5 Workdays; PCBA: 15-20 workdays
Payment Terms : T/T,Western Union
FOB Price : US $ 0.1-5/ PieceGet Latest Price
Printed Circuit Board : FR4 1-38 Layer PCB
Place of Origin : Guangdong
Brand Name : Xing Da
Number of Layers : 4-Layer
Model Number : XD-0016
Base Material : FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic,crockery,Metal,Aluminium
Surface Finishing : HASL / HASL lead free, Chemical tin, Chemical Gold, Immersion Gold
Board Thickness : 0.2mm-6.00 mm(8mil-126mil)
Min. Line Spacing : 0.1mm4mil)
Min. Line Width : 0.075mm(3mil)
Copper Thickness : 1/2 oz min;12 oz max
Min. Hole Size : 0.1mm(4mil)
Category : Multilayer PCB
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Cell Phone HDI PCB
1.PCB&PCBA
2.Soon respond&Fast delivery
3.ISO9001/TS16949/IPC/ROHS/UL
4.High QualityReasonable Price

FR4 1-38 Layer PCB;low price pcb manufacturer;Pcb Routing;Pcb Cutting Machine;Electronic pcb board;FR4 Double-sided PCB. Cell Phone HDI PCB

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We-can-prvide-a-package-of-service:-

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-·-1.-PCB-layout,-PCB-design;-

·-2:-Make-high-difficulty-PCB(1-to-38-layers)-

·-3:-Provide-all-Electronic-components;-

·-4:-PCB-assembly;--

·-5:-Write-programs-for-clients;--

·-6:-PCBA/finished-product-Test.-

·-etc…

Specification-for-PCB-Manufacture:

Item

Specification

Numbr-of-Layer

1-38Layers

Material

FR-4,FR2.Taconic,Rogers,-CEM-1-CEM-3,ceramic-,-crockery

Metal-backed-Laminate

Remarks

High-Tg-CCL-Is-Availabe(Tg>=170ºC)

Finish-Board-Thickness

0.2mm-6.00-mm(8mil-126mil)

Minimun-Core-Thickness

0.075mm(3mil)

Copper-Thickness

1/2-oz-min;12-oz-max

Min.Trace-Width-&-Line-Spacing

0.075mm/0.1mm(3mil/4mil)

Min.Hole-Diameter-for-CNC-Driling

0.1mm(4mil)

Min.Hole-Diameter-for-punching

0.9mm(35mil)

Biggest-panel-size

610mm*508mm

Hole-Positon

+/-0.075mm(3mil)-CNC-Driling

Conductor-Width(W)

+/-0.05mm(2mil)or

+/-20%-of-original-artwork

Hole-Diameter(H)

PTH-L:+/-0.075mm(3mil)

Non-PTH-L:+/-0.05mm(2mil)

Outline-Tolerance

+/-0.125mm(5mil)-CNC-Routing

+/-0.15mm(6mil)-by-Punching

Warp-&-Twist

0.70%

Insulation-Resistance

10Kohm-20Mohm

Conductivity

<50ohm

Test-Voltage

10-300V

Panel-Size

110×100mm(min)

660×600mm(max)

Layer-layer-misregistration

4-layers:0.15mm(6mil)max

6-layers:0.25mm(10mil)max

Min.spacing-between-hole-edge-to-circuity-pqttern-of-an-inner-layer

0.25mm(10mil)

Min.spacing-between-board-oulineto-circuitry-pattern-of-an-inner-layer

0.25mm(10mil)

Board-thickness-tolerance

4-layers:+/-0.13mm(5mil)

6-layers:+/-0.15mm(6mil)

Impedance-Control

+/-10%

Different-Impendance

+-/10%

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Detailed terms for PCB Assembly

Technical requirement

1)Professional surface-mounting and Through-hole soldering technology

2)Various sizes like 1206,0805,0603 components SMT technology

3)ICT (In Circuit Test),FCT (Functional Circuit Test ) technology

4)PCB Assembly with VL.CE.FCC.Rohs Approval

5)Nitrogen gas reflow soldering technology for SMT

6)High standard SMT&Solder Assembly Line

7)High density interconnected board place ment technology capacity-----

Quote requirement

1)genber file and Bom list

2)clear pics of PCBA or PCBA Sample for us

3)Test Method for PCBA

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